Die Attach Process Tool Development for Voids Calculation

In terms of production control robustness and detection, void detection is one of the challenges when using non-conductive adhesives, especially die attach film (DAF) for semiconductor integrated circuits (IC) products. In this paper, a specialised method is introduced that can discern and calculate the amount of DAF voids, with the use of semi-auto grid lines resulting in more precise measurement and defect call-out. The in-house software tool is a less expensive alternative to X-ray inspection, but it has been found to be ineffective at detecting holes and un-occupied areas within the adhesive thickness, resulting in overestimation of output rejects. Finally, the use of the new method resulted in improved voids measurement precision and reputation.

Author (s) Details

Frederick Ray I. Gomez
STMicroelectronics, Inc., Calamba City, Laguna, 4027, Philippines

Rennier S. Rodriguez
STMicroelectronics, Inc., Calamba City, Laguna, 4027, Philippines

Nerie R. Gomez
STMicroelectronics, Inc., Calamba City, Laguna, 4027, Philippines

View Book :- https://stm.bookpi.org/AAER-V10/article/view/758

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