Developing the Numerical Simulation of Multicomponent Alloy Solidification

A non-equilibrium model was used to study multicomponent melt solidification, in which a Stefan problem with two borders was addressed numerically, the boundaries being between the solid phase and the two-phase transition zone, and between the two-phase transition zone and the liquid phase. The two-phase zone is represented by a porous material with varied porosity. The additional force preventing melt flow due to porosity is taken into account in the same way that Darcy’s law is taken into account. Computer simulations were used to simulate the solidification of Sn-20 wt. percent Pb binary alloys via the process of downward-directed crystallisation along the gravity vector. The results of a quasi two-dimensional benchmark experiment on horizontal (i.e., perpendicular to the gravity vector) directional solidification of a binary Sn-3 wt. percent Pb alloy are presented in the publication. Two crystallisation models were used in the calculations: equilibrium and non-equilibrium crystallisation. The non-equilibrium model is proven to provide a more accurate depiction of natural convection-induced heat field evolution and solute dispersion. Solidification, binary alloy, dual-phase region, macrosegregation, convection, heat-mass transfer, modelling, comparison with experimental results, columnar-to-equiaxed transition Keywords: solidification, binary alloy, dual-phase region, macrosegregation, convection, heat-mass transfer, modelling, comparison with experimental results (CET).

Author (S) Details

V. P. Ginkin
Institute for Physics and Power Engineering (IPPE), Bondarenko sq.1, 249033 Obninsk, Russia.

S. M. Ganina
Institute for Physics and Power Engineering (IPPE), Bondarenko sq.1, 249033 Obninsk, Russia.

A. V. Kartavykh
Technological Institute for Superhard and Novel Carbon Materials (TISNCM, Moscow branch), B.Tolmachevsky per.5, 119017 Moscow, Russia.

View Book :- https://stm.bookpi.org/AAER-V16/article/view/1988

Leave a Reply

Your email address will not be published. Required fields are marked *